Samsung recently announced its new DDR4 memory module ready to spread into market. With new TSV (through silicon via) technology and double capacity, 128GB compared to the previous 64GB DDR4, the company believes it’s a big shot to carry heavy duties in transferring huge amounts of data of enterprise data centers and servers speedily.
Being created through Samsung’s state of the art 20-nanometer process technology with buffer data chips inside, this new memory module doesn’t only bring a faster data transferring process, up to 3,200 Mbps but also have high efficiency in energy need.
The release date and pricing
Samsung TSV 128GB DDR4 is starting its mass production now. You can expect this new monster will be available Q2 2016. And as for the price, it could be around $2000.